Chiplet Optimization in Production
Improving quality and reliability of dies pre-assembly
Chiplet Monitoring in the Field
Assuring performance and reliability during operation in mission mode
Die-to-Die Interconnect in Production
Yield improvement via per-lane quality assessment and lane repair of the assembled product
Die-to-Die Interconnect Monitoring in the Field
Assuring reliability of the interconnect in mission mode
Lane performance (eye width and jitter) acrossprocess, voltage, and temperature ranges
Test coverage and test time optimization
Inter-lane skew and cross-talk characterization
Lower DPPM with advanced outlier detection
Improved yield with spare lane swapping
Improved quality with per lane grading
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Lane degradation monitoring (spare lane, module swap)
Time-to-failure prediction
Alerts on faults before failures
KGD (Known Good Die) selection and binningfor improved test quality during Wafer Sort
Yield and binning optimization
Shift left decisions to Wafer Sort
Die matching for inventory management
In-situ collection of measurements from widespread on-chip agents and their automatic transmission to cloud and edge software for advanced analytics using machine learning algorithms.
Interconnect performance monitoring
Performance and degradation monitoring
Operational and application monitoring
Material classification and design profiling
Automated IP insertion at high coverage
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This webinar offers 3 unique perspectives on this growing market and ecosystem:
Stefan Chitoraga, Technology and Market Analyst at Yole Intelligence, part of Yole Group, presents the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.
Igor Elkanovich, CTO at Global Unichip Corp. (GUC) discusses the GUC GLink™ chiplet interconnect, including its architecture and roadmap; HBM3 memory interfaces; and will also highlight some of the 2.5D and 3D packaging challenges.
Nir Sever, Senior Director of Business Development at proteanTecs reveals silicon results from a GUC GLink chip, which used Die-to-Die interconnect monitoring for comprehensive visibility and parametric lane grading.
proteanTecs is the leading provider of deep data analytics for advanced electronics monitoring. Trusted by global leaders in the datacenter, automotive, communications and mobile markets, the company provides system health and performance monitoring, from production to the field. By applying machine learning to novel data created by on-chip monitors, the company's deep data analytics solutions deliver unparalleled visibility and actionable insights—leading to new levels of quality and reliability. The company is headquartered in Israel with offices in the United States, India, South Korea and Taiwan.
Serving key customers in Automotive, Datacenter, Mobile and Communications.